| 摘要 |
An optical semiconductor device 1 a includes a lead frame 4 having an aperture 7 , a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7 , a semiconductor optical element 3 which has an optical portion 6 and which is mounted on a surface of the submount 8 opposite to a surface on a side of the aperture 7 with the optical portion 6 facing the aperture 7 through the submount 8 , a molding portion 10 made of a non-transparent molding resin which exposes at least a region including the aperture 7 on the other surface side of the lead frame 4 and which encapsulates the lead frame 4 , the semiconductor optical element 3 and the submount 8 , and a lens 9 disposed on the other surface of the lead frame 4 to close the aperture 7.
|
