| 摘要 |
A light-transmitting member is previously formed, and then integrally molded during a process of molding a structure member. A solid-state imaging apparatus has: the structure member configured by an insulating resin and having a through-opening portion; a wiring portion which is formed on the surface of the structure member; a solid-state image pickup element connected to the wiring portion and attached to the through-opening portion; and a light-transmitting member which is placed to cover the through-opening portion with being separated from the solid-state imaging element by a predetermined distance The light-transmitting member is configured by a plate-like member made of a material which is smaller in coefficient of linear expansion than the insulating resin, and integrally molded with the structure member to be embedded at a peripheral portion into the structure member. |
