3D INTEGRATED COMPASS PACKAGE

摘要

A 3 dimensional integrated compass package having a sensor support chip is provided to offer the 3 dimensional integrated compass package controlling signal by using an assembling process of low cost. A 3D integrated compass package(10) includes a hardening substrate(12) having a top surface(14), an ASIC(A7application Specific Integrated Circuit), and the X axis sensor(20) and Z-axis sensor(30). The application specific integrated circuit is adhered to the top surface while including the input-output pad. The pad includes a LCC(Leadless Chip Carrier) design and BGA(Ball Grid Array) having I/O pad arranged in the grid. The X axis sensor is positioned on an upper surface of the hardening board for sensing physical variable along the X axis.