| 发明名称 | Resin lapping plate and lapping method using the same | ||
| 摘要 | The present invention provides a lapping plate, which provides a high lapping rate and also can suppress the generation of scratches on a surface of a polishing workpiece. The present invention provides a resin lapping plate comprising a resin sheet comprising a thermosetting polyurethane resin and having an opening rate of 10 to 50% and a Young's modulus of 7.0×107 to 5.0×108 N/m2. | ||
| 申请公布号 | US9370853(B2) | 申请公布日期 | 2016.06.21 |
| 申请号 | US201414570789 | 申请日期 | 2014.12.15 |
| 申请人 | FUJIBO HOLDINGS, INC. | 发明人 | Itoyama Kouki;Suzuki Motofumi |
| 分类号 | B24B37/20;B24B37/14;H01L21/304;B24B37/24;H01L21/02;H01L29/16 | 主分类号 | B24B37/20 |
| 代理机构 | Squire Patton Boggs (US) LLP | 代理人 | Squire Patton Boggs (US) LLP |
| 主权项 | 1. A resin lapping plate, comprising a resin sheet comprising a thermosetting polyurethane resin and having an opening rate of open pores of 10 to 50% and a Young's modulus of 7.0×107 to 5.0×108 N/m2. | ||
| 地址 | Tokyo JP | ||