| 摘要 |
PURPOSE:To simplify a process for forming a resist pattern by irradiating a film made of the composition containing a specified polymer with light and heating it after development. CONSTITUTION:This photosensitive resin composition contains the polymer (A) having structural units represented by the formula; -(RMO1.5)- in which R is an organic group, and M is a metal atom. The film made of this composi tion is formed on a substrate, prebaked, imagewise exposed, developed, and then, heated together with the substrate to decompose a part of the organic materials or all of them in the composition and to form a pattern made of metal oxides or the like. The polymer A can be embodied by a polymer obtained by introducing acetyl chloride into polymethylsilsesquioxane, and the like and the film of the composition can be formed by using a solution containing the polymer and a photosensitive agent, such as o- naphthoquinonediazide. |
