COOLING APPARATUS USING THERMOELEMENT MODULE

摘要

The present invention relates to a cooling structure of a cooling device. More specifically, the present invention relates to a cooling structure of a cooling device, cooling a heat dissipation unit of the cooling device using a thermoelectric module. The present invention comprises: a thermoelectric module unit; a first housing (100); a second housing (200); and a second air flow forming unit (240). A first heat exchanging unit comprises: a thermal transmission block (510); a cooling unit (560); and a circulation pump (540).