| 摘要 |
<p>PURPOSE:To obtain a high precision, high density thick film hybrid IC by setting the contact angle between the plane of a conductor pattern board to be cut with laser beam and the side plane of a conductor circuit, within 90+20. CONSTITUTION:Being coated with paste and silk-printed, a conductor film 41 is formed on a substrate. The film is processed with a laser 43 before or after calcination so that it may be possible to obtain a specified line width and line interval of 50mum or below. Processing means include electron beams, sand grain beams, and ion beams, in addition to the laser processing 43. They are used on a single or combination basis. The contact angle between the plane of the substrate 42 and the side plane of high precision conductor pattern 41 is adapted to range from 90 deg.+ or -20 deg.. This construction makes it possible to form a high precision wiring pattern and to manufacture on excellent high frequency thick film substrate, using a thick film copper conductor.</p> |
