| 摘要 |
PURPOSE:To improve adhesion properties and heat resistant properties by forming an insulation layer which is connected with a signal circuit as an interlaminar insulation film with a paste compound comprising a specified amount of fluorinated carbon resin powder having a specified maximum grain size in terms of a resin portion mainly compound of resin portion contained in terms of a thermosetting resin varnish mainly compound of cyanic acid ester where plasma surface processing is carried out. CONSTITUTION:A chemical compound represented by the equation is favorable as cyanic acid ester where (m) in the equation is one or more, preferably two or more. Generally, (m) is an integer below 5. R represents an organic group where cyanic acid ester group is bonded with an aromatic ring of the organic group R. The maximum size of fluorinated carbon resin powder should be preferably 50mum and below in order to minimize the roughness of an internal wall when a multilayer printed wiring board is to be drilled. When the grain size is increased, the roughness of the internal wall is increased. The fluorinated carbon resin powder where plasma processing is carried out for a resin reactant 100 pts.wt. contained in the varnish as paste compound, ranges from 10 to 200 pts.wt. When it is 10 pts.wt. and below, the lower epsilon effect is small while the performance of thermosetting resin as a binder is lowered, thereby degrading the strength and the outside view, if it is 200 pts. wt. and over. |
