| 摘要 |
PURPOSE:To obtain ceramic for loading a chip of semiconductive integrated circuit inducing a slight stress to the chip and generating a small propagation delaying of a signal by burning a mixture of aluminosilicate glass powder and silicate glass. CONSTITUTION:For instance, 1000-1500g aluminosilicate glass powder is mixed with 200-1000g silicate glass, 100-300 g binder, 30-120ml plasticizer and 1000-1600ml solvent in a ball mill for 12-48 hr. Resultant slurry is deaerated and subjected to aging to have a fixed viscosity, then made to a green sheet. Said sheet is punched and a pier is pierced, then the pier is filled with electroconductive paste such as copper or gold, thus a wiring pattern is printed with electroconductive paste and the green sheets are laminated after drying. Then, resultant laminate is punched in a fixed shape, thus burned to afford a laminated material of ceramic. Said circuit base has a linear expanding coefficient near to the value of GaAs integrated circuit, dielectric constant smaller than the value of alumina and a small resistance to continuity. |
