| 摘要 |
PURPOSE:To enable a diamond to be ground efficiently by putting the side surface of a laser beam in contact with the surface of a diamond, and relatively moving the side surface thereof along the designed grinding surface. CONSTITUTION:The surface 1a of a diamond 1 is irradiated with a laser beam 4 of a laser producing apparatus, e.g., YAG laser apparatus 3. At this time, the irradiation angle theta is made 15 degree with respect to the designed grinding surface 1b, and the side surface 4a of the laser beam 4 is allowed to be parallel with the designed grinding surface 1b. The laser beam 4 of the YAG laser apparatus 3 is converged by the use of a lens 5 of 50 mm focal distance. An X-Y table 2 is moved in the direction indicated by arrow 2Y and, when the surface 1a of the diamond is brought into contact with the side surface 4a of the laser beam, the side surface 4a of the laser beam 4 comes in contact with the entire surface 1a of the diamond and gives heat energy thereto. Thus, recessed and protruded parts on the surface 1a of the diamond are removed therefrom and, in consequence, the surface becomes flat thereby. |
