| 摘要 |
PURPOSE:To obtain the subject composition effective in suppressing the warpage of a semiconductor element after bonding the element to a supporting member by using a reaction product of an epoxy resin and an acrylonitrile-butadiene copolymer, a specific phenolic resin, silver powder and a silica filler as essential components. CONSTITUTION:The objective composition contains (A) a product produced by reacting (i) an epoxy resin containing >=2 epoxy groups in one molecule and having a viscosity of <=5Pa.S at 25 deg.C with (ii) an acrylonitrile-butadiene copolymer containing >=2 carboxyl groups in one molecule at a molar ratio of 85/15 to 60/40, (B) a novolak phenolic resin, (C) preferably 60-80wt.% of silver powder having an average particle diameter of preferably 1-5mum and (D) preferably <=2wt.% of a silica-based filler having maximum particle diameter of <=0.1mum. |
