| 摘要 |
PURPOSE:To miniaturize the entire part of a device by forming a recessed part for holding a substrate for an opto-electronic integrated circuit on the outer side of a ceramic substrate for an electronic integrated circuit and forming apertures for connecting this ceramics substrate and the substrate for the opto- electronic integrated circuit. CONSTITUTION:The recessed part 18 for holding the substrate 8 for the opto- electronic integrated circuit is formed on the outer side of the ceramic substrate 9 for the electronic integrated circuit and the apertures 19, 10 for connecting the ceramics substrate 9 and the substrate 8 for the opto-electronic integrated circuit are formed to this ceramic substrate 9 for the electronic integrated circuit. The substrate 8 for the integrated circuit and the substrate 9 for the electronic integrated circuit are, therefore, integrated and constituted by inserting the substrate 8 for the opto-electronic integrated circuit mounted with the opto- electronic integrated circuit having a photodetector into the recessed part 18 formed on the outer side of the ceramic substrate 9 and connecting the opto- electronic integrated circuit and the electronic integrated circuit 12 via the apertures 19, 20. The entire part of the device is miniaturized in this way. |
