| 摘要 |
<p>PURPOSE:To enable adhesion of a foreign object to be reduced while retaining a rotary body uniformly by providing a plurality of projecting parts which contact a rear surface of a plate-shaped body in dot shape on a surface for retaining the rotary body for retaining a rear surface of the plate-shaped body at the rotary body which can be rotated by vacuum sucking. CONSTITUTION:For retaining a plate-shaped body (for example a wafer) at a retaining device, a plate-shaped body which is carried by a carrying device (such as a handler) is placed on a sucking surface 3 and then a vacuum pump is operated to allow a negative pressure to be produced at a vacuum hole 4, thus causing a rear surface of the wafer to be held at a suction surface side 3 and a wafer to he fixed to a rotary body 1 while a contact surface 8 of a protruding part 2 is pressed on the rear surface of the wafer. At this time, a space is formed around a contact surface 8. Since this space communicates with the vacuum hole 4, vacuum suction force is uniformly given to the rear surface of the wafer. Then, since a surface area at a tip (peak) of a protruding part 2 is small, entire contact area for the wafer can be reduced to, for example, 1/8 as compared before and the amount of adhering foreign objects can also be reduced to 1/8.</p> |
