| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve low-cost stabilization in quality of a semiconductor device by mounting a semiconductor element having passed an adequate test of electrical characteristics on a substrate through common use of a package substrate as a relay substrate. <P>SOLUTION: The semiconductor device 3 includes a package substrate 300 having an upper surface 3a and a lower surface 3b and a semiconductor element 30 mounted on the upper surface 3a of the package substrate 300. The package substrate 300 includes pads 303, 903 arranged on the upper surface 3a, a pad 904 arranged on the lower surface 3b, and an exclusive pad 905 for testing arranged on the lower surface 3b. The semiconductor element 30 is electrically connected to the pad 303 and the testing pad 903, respectively. The pad 904 includes an external connecting terminal 401 but the testing pad 905 is not provided with this terminal 401. The pitch of the pad 904 is wider than that of the pad 303. <P>COPYRIGHT: (C)2010,JPO&INPIT |
