发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To protect a pad from moisture and to strengthen the connection to an external interconnection by a method wherein a gold film is formed in the center of the pad composed of aluminum, a titanium film is then formed, the film is sintered and the gold film is exposed. CONSTITUTION:An aluminum film 3 is formed on an interlayer insulating film 2; it is patterned; a pad 5 is formed. Then, the central region of the pad 5 is covered with a gold film 7; a titanium film 8 is laminated on the whole surface. The film 8 is sintered; a titanium alloy layer 9 is formed on the surface of the pad 5; the film 8 is etched and removed; the film 7 and the film 9 are exposed. Then, an external interconnection 11 is connected to the film 7. When the titanium film is removed, the gold film is exposed and a titanium alloy is formed in other regions in this manner, it is possible to protect the pad from moisture and to strengthen the connection of the external interconnection to the pad.
申请公布号 JPH03297145(A) 申请公布日期 1991.12.27
申请号 JP19900099900 申请日期 1990.04.16
申请人 FUJITSU LTD;KIYUUSHIYUU FUJITSUU EREKUTORONIKUSU:KK 发明人 KOTSURU HIDEAKI
分类号 H01L23/52;H01L21/3205;H01L21/60 主分类号 H01L23/52
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