| 摘要 |
<p>PURPOSE:To shorten wire length by constructing the title frame such that inner leads are located in the direction of a die pad by bonding alternately members to the upper and lower surfaces of the tip ends of the inner leads using a conductive bonding agent. CONSTITUTION:Members 6a are bonded to the tip end upper surfaces of inner leads 4 and members 6b bonded to the tip end lower surfaces of the same, using a conductive bonding agent. The members 6a, 6b are connected to a bonding pad 2 formed on a semiconductor device 1 through a wire 5. The members 6a, 6b are mounted alternately onto the tip end upper and lower surfaces of the leads 4 in the same construction when the leads 4 is located in the direction of a die pad 3 in such a manner. Hereby, wire length is shortened to prevent any wire bend, wire sag and wire flow when sealing resin is injected in a molding process.</p> |
