| 摘要 |
<p>PURPOSE:To improve a semiconductor device in heat dissipating property and reliability of bonding connection by a method wherein a film base material located nearly at a center is reinforced with a reinforcing material. CONSTITUTION:A reinforcing material 40 is provided in one piece to the side of a film base material 10 opposite to its side where an electronic component 30 is mounted. The reinforcing material 40 is larger than the inner leads 21 of the leads 20 in area and formed of a metal plate of copper or the like, and the joints of the inner leads 20 with bonding wires 31 are backed up with the reinforcing material 40 from its side opposite to the film base material 10. Furthermore, the reinforcing material 40 is provided with a cutout 42 formed by protruding the peripheral part of the reinforcing material 40 in contact with the film base material 10, a sealing resin 50 is formed on the cutout 42 in one piece, and the face of the reinforcing material 40 opposite to its side which faces the electronic component 30 is exposed out of the sealing resin 50.</p> |
