| 摘要 |
1,239,862. Electro-depositing tin-nickel alloys. HUDSON WIRE CO. April 25, 1969 [May 2, 1968], No.21358/69. Headings C7A and C7B. A Cu substrate e.g. wire or rod conductor is plated with a Sn-Ni alloy containing 3 to 20% Ni to render it solderable by electro-deposition from a fluoroborate bath having a Ni to Sn ion ratio of 3:1 to 2:1, pH of 1À5 to 6 and temperature of 140- 180‹ F., using a current density of 25 to 150 A.S.F. and separate Ni and Sn anodes. The bath may contain a solution of nickel and stannous fluoroborate, sodium bicarbonate or ammonium hydroxide as pH regulator and ammonium bifluoride as brightener. Prior to plating, the substrate may be electrolytically cleaned in alkaline cleaner containing NaCN. Plated wire may be drawn and resistance annealed. The substrate may be of Cu, a Cu alloy, e.g. Ag-Cu, Cd-Cu, Cd-Cr-Cu, Zr-Cu or Cr-Cu, or a Cu-clad metal e.g. steel or A1. |
