HEAT SINK ASSEMBLY FOR SEMICONDUCTOR DEVICES,申请号USD3509429-传众专利搜索

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发明名称	HEAT SINK ASSEMBLY FOR SEMICONDUCTOR DEVICES
摘要
申请公布号	US3509429(A)	申请公布日期	1970.04.28
申请号	USD3509429	申请日期	1968.01.15
申请人	INTERN. BUSINESS MACHINES CORP.	发明人	RAYMOND M. CRAIG;JAMES W. CROWE;EARL L. WILKIE
分类号	H01L23/36;(IPC1-7):H01L5/02	主分类号	H01L23/36
代理机构		代理人
主权项
地址

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