发明名称 MARKING OF ELECTRONIC PART
摘要 PURPOSE:To eliminate the preparation of a matrix material, to make a marked character easy to see and to dispense with a post process by applying marking to a plastic electronic part by marking processing and immediately bonding thermosetting powder ink to the marked part to melt the same by the heat obtained at the time of marking to color the carved part. CONSTITUTION:When marking processing is applied to an electronic part matrix material (plastic) 7 by the laser beam emitted from a laser emitting part, the marked part of the matrix material becomes a groove. Further, the part 1 subjected to the marking processing due to laser beam becomes high temp. by the processing heat of laser beam. When thermoplastic powder ink 5 is sprayed to the groove heated to high temp. from a thermosetting powder ink spray nozzle 4 immediately after processing, the ink 5 is bonded to the inside of the high temp. groove to form a marked character as shown by the ink 6 bonded and solidified by heat. The thermosetting powder ink emitted from the thermosetting powder ink spray nozzle is bonded only to the inside of the high temp. groove and the other ink not bonded to the groove is blown off to be bonded only to the marked part.
申请公布号 JPH047194(A) 申请公布日期 1992.01.10
申请号 JP19900107618 申请日期 1990.04.25
申请人 HITACHI LTD 发明人 MIHARA MAKOTO;MOGI TAKEO;KUSHIDA NORIYUKI
分类号 B41M5/26;H01L23/00 主分类号 B41M5/26
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