发明名称 PACKAGE FOR SEMICONDUCTOR LASER
摘要 PURPOSE:To easily set the input impedance of a semiconductor laser package by drawing out the electrodes of a semiconductor laser secured on a board by a circuit pattern formed on a ceramic board out of a case. CONSTITUTION:A semiconductor laser 1 is secured on a ceramic board 3 through a heat sink 2 made of silicon single crystal. A pyramidal case 4 and a cover 6 are so disposed on the board 3 as to cover a part on which the laser 1 is secured, and the case is hermetically sealed with the board 3. A hole is formed at the side of the case 4, and a glass window 5 for emitting a light emitted from the laser 1 out of the case is formed at the hole. A circuit pattern of a gold thick film, a signal line 41 and a ground pattern 42 are formed on the board 3, and connected to the laser 1 via gold wires. Since the pattern on the board 3 can be freely set in size, the line 41 and the pattern 42 are regarded as being striplines as seen out of the case, and an input impedance is freely altered to be designed.
申请公布号 JPH04782(A) 申请公布日期 1992.01.06
申请号 JP19900102264 申请日期 1990.04.18
申请人 NEC CORP 发明人 FUJITA MASAYUKI
分类号 G02B6/42;H01S5/00;H01S5/022;(IPC1-7):H01S3/18 主分类号 G02B6/42
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