| 摘要 |
<p>PURPOSE:To achieve cost reduction by mounting an IC incorporating an amplifying circuit on a weight, electrically connecting the bridge terminal at a diffusion resistance part with the amplifying circuit through a bump, thereby amplifying the differential voltage and leading out to the outside. CONSTITUTION:A diffusion resistance part 2 is formed in the center of a semiconductor cantilever beam 1 and selectively diffused with impurities. A weight 13 contains an IC incorporating an amplifying circuit and jointed through a bump 14 to the beam 1 while furthermore connected electrically with each bridge terminal through the bump 14. When the weight 13 is subjected to acceleration alpha, differential voltage between the bridge terminals is fed through the bump 14 to the amplifying circuit in the weight 13 where it is amplified and fed through the bump 14 to the amplifying circuit in the weight 13 where it is amplified and fed through the bump 14 to a wire 5. Consequently, no external amplifying circuit is required resulting in cost reduction.</p> |
