| 摘要 |
1315401 Semi-conductor devices PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 24 June 1970 [27 June 1969 24 Jan 1970] 30684/70 Heading H1K A support for a semi-conductor body comprises a metal base member of iron, an iron alloy, copper, nickel or a copper or nickel alloy, an outer layer of gold providing a surface for securing a semi-conductor body to the support, and an intermediate layer between the base member and gold layer of a metal which crystallizes in a hexagonal close packing arrangement. The intermediate layer may be of cobalt, osmium, rhenium, ruthenium, titanium or zirconium. Leads may pass through the base member insulated therefrom by glass. The body may be secured to the gold layer by a goldsilicon eutectic. The intermediate layer is said to prevent the grain structure of the base member from influencing the structure of the gold layer, such influence normally causing poor solder joints. |
