| 摘要 |
PURPOSE:To fix a semiconductor wafer uniformly on a wafer-holding plate a so as to lap the wafer into a mirror face having a high-accuracy flatness by regulating the face roughness within a specified range. CONSTITUTION:The face roughness is regulated Ra=0.5-3.0mum. After a water- holding plate 2 is used for polishing a semiconductor wafer 1, it is lapped into a face roughness of Ra=0.5-3.0mum with a lap material of relatively large grain size, and then washing treatment is made with a chemical solution containing NaOH. Metal, glass, ceramic, etc., are preferable as the material used for the above-mentioned wafer-holding plate 2. This can prevent the generation of recesses of an as-polished semiconductor wafer 1 by the intrusion of dust 4 into the recesses even in the case where the dust 4 is present on the wafer- holding plate 2. Because of surface roughness, an adhesive 3 well creeps and uniformly distributes so that the semiconductor wafer 1 can uniformly be adhered to the wafer-holding plate 2. |
