Metallisation of semiconductor surface - using metal soln/suspension

摘要

Surface of electrical element, esp. Si planar semiconductor element, is metallised by applying liquid soln. or suspension contg. metal to surface to be metallised, evaporating liquid and converting residual metal cpd. to pure metal by heating, then sintering or alloying with semiconductor surface. Metal coating adheres well and hence can be used as contact. Process is economical and does not require great expenditure on apparatus.