| 摘要 |
<p>PURPOSE:To lessen a mechanical stress induced in an IC chip so as to enhance the IC chip in effective area by a method wherein the corners of the IC chip are cut off. CONSTITUTION:The corners of an IC chip are cut off. That is, when the IC chip is subjected to an acceleration test or in a normal operation, a temperature gradient is induced on the surface of the IC chip due to heat released from electric resistors or the like provided inside an integrated circuit, so that a mechanical stress S is generated at the corners of the IC chip 1. Therefore, the corner of the IC chip 1 is cut off along a line which forms an angle of 45 deg. or so with the side of the chip 1 to provide eight corners of an angle of 135 deg. or so to the periphery of the chip 1. The induced stress is dispersed and lessened as compared with a chip where its corners are not cut off. By this setup, the IC chip 1 can be enhanced in effective area, so that a wiring 2, elements, and others can be arranged in a wider range on the IC chip 1.</p> |
