| 摘要 |
<p>PURPOSE:To discriminate good pellet within a short period without giving damage thereto by adhering a double-sided seal to a defective device segment after electrical characteristic test for respective semiconductor device segments on a wafer, adhering a sheet to the upper surface after separating device segment by cutting the wafer, simultaneously removing many defective device segments. CONSTITUTION:Electrical operation and characteristic of a semiconductor wafer 1 on which electrical circuit 3 is formed are measured. A probe 2 of the measuring instrument is placed in contact with an electrode 4 of a pellet. The result of discrimination controls an automatic attaching jig 5 with a good/no-good signal of the measuring instrument and a defective mark seal 6 having adhesiveness at both sides is attached to a fault pellet. Next, a semiconductor wafer 1 is attached to an adhesive sheet 8, each semiconductor pellet is separated by a method such as dicing. Thereafter a defective pellet removing sheet 9 is placed on a semiconductor wafer 1. Thereby, a defective pellet 7 is adhered to the sheet 9 through the defect mark seal 6 having sufficient adhesiveness at both sides. Here, the sheet 9 is removed. Accordingly, defective pellets 7 can be removed at a time without giving damage on the good pellets 10.</p> |
