| 摘要 |
<p>1,257,659. Integrated circuits. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 5 May, 1969 [8 May, 1968], No. 22808/69. Heading H1K. An integrated circuit comprises two semiconductor bodies, one containing a circuit element and the other a complementary element, and each having at one face a surface insulating layer and a pattern of conductive connections thereon contacting the circuit elements via apertures therein. The bodies are united face to face so that the conductive patterns are electrically connected. In the arrangement shown prior to assembly in Fig. 1 wafers 1, 21 of 1-10 ohm cm. P and N type silicon respectively contain complementary IGFETS as shown and mating L-shaped diffused diode region 14 and metal strip 40 respectively. In assembly body 21 is inverted over the other with contact pads 9-12 and 17 left exposed, correct location being established by reverse biasing the diode region 14 relative to body 1 and connecting an HF supply between body 21 (and thus strip 40) and earthed body 1. The alternating current across the junction is monitored and a maximum value is indicative of correct alignment. Alternatively one wafer is formed with a diffused photodiode and the other with a mating lacquer dot loaded with luminescent powder. After illumination of the latter assembly is effected. In this case maximum photodiode current indicates proper alignment. Bonding is effected by soft-soldering or ultrasonic welding. Alternative embodiments incorporate annular channel IGFETs or bipolar transistors, sometimes with several circuit elements in each body, and the bodies may be assembled so as to leave contact pads exposed on both. Also the complementary devices may be formed in epitaxial layers of opposed types on wafers of any type.</p> |
