| 摘要 |
PURPOSE: To form an electric circuit of higher density for inter-layer connection of a multi-layer substrate using a once-applied resist for two pattern exposure/ development, preventing non-conformity in position between a lower layer circuit and a pillar. CONSTITUTION: On a surface of an organic insulating resin 7 and a pillar 5, an upper layer electric circuit metallic layer 8 of copper, etc., is formed by, for example, such film-forming method as electroplating. With ceramics, silicon, glass substrate, for a thin metal layer, such film-forming as sputtering and vapor-deposition are possible. Thus, a lower layer electric circuit 6 is connected electrically to an upper layer electric circuit 8 through the pillar 5. Thus, a process such as above may be repeated for the formation of a multi-layer wiring. Instead of the formation of an upper layer electric circuit metal layer, an electronic part 10 which is to be an upper layer electric circuit is attached to the pillar 5 with a solder 9. For the pillar 5, thickness of a copper or a pillar formed on the copper with solder or tin can be arbitrarily changed. |
