| 摘要 |
PURPOSE:To remarkably shorten the molding time of resin and increase the efficiency of resin sealing process by forming a cavity with components which emits infrared rays when heated. CONSTITUTION:Semiconductor elements 3 are accumulated at the center of a cavity 8 and a lead frame 2 is clamped by cavity blocks 4 and 5, upper and lower, and then the cavity blocks 4 and 5 and side infrared ray emitting components 6 and 7 are heated up to the temperature of 160 - 180 deg.C by heaters 9 and 10. Then heat-curing resin is injected into the cavity 8. Infrared rays are emitted out of the heated infrared ray emitting components 6 and 7 into the cavity 8, and particularly the infrared rays of long wave are transmitted into the resin in the cavity 8 to heat the resin efficiently. The resin in the cavity 8 can be cured temporarily to the extent of being able to remove a mold 1 in the time of half to one-third of the existing process by using the power of heaters 9 and 10 same as the existing process because of the heating of infrared rays and molded to seal the semiconductor elements 3.
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