| 摘要 |
A method of fabricating a photoconductive pickup tube utilizing a one-piece envelope, with a closed-end faceplate portion, wherein a unitized mount structure is positioned. The integrated mount includes a beam forming portion with a mesh electrode oriented relative to the frontal end thereof. The unitized array continues whereof a target substrate, having a photoconductive target electrode formed thereon, is insulatively spaced from the mesh electrode. Resilient means are terminally employed to spaced the target substrate from the interior surface of the envelope faceplate, and a connective means for the target electrode is extended in an insulated manner along the mount to emerge from the base portion of the envelope.
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