| 摘要 |
PURPOSE:To obtain the solid-state image pickup element which can be made smaller by arranging a first connection means performing electrical connection between the solid-state image pickup element and an IC chip and a second connection means extended from the solid-state image pickup element without through the IC chip on different side-part sides in the solid-state image pickup element and the IC chip. CONSTITUTION:This solid-state image pickup element is the one equipped with the solid-state image pickup element and an IC chip 66, and a CCD chip 61 and the IC chip 66 are connected by face bonding, further, an inner lead 62 performing the electrical connection between the CCD chip 61 and the IC chip 66 and an external lead 68 used as inner lead extended from the CCD chip 61 without through the IC chip 66 are arranged on the side-part side different each other in the CCD chip 61 and the IC chip 66. Thus, the minituarization of the solid-state image pickup element can be realized in comparison to arranging on the same side as the lead 62 and the lead 68.
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