| 摘要 |
<p>PURPOSE:To reduce the power supply impedance as viewed from a semiconductor chip with a capacitor installed at the shortest position by incorporating a bypass capacitor in a semiconductor and by electrically connecting the stage of the chip to one electrode of the capacitor. CONSTITUTION:A semiconductor chip 1 fixed on a stage 3 is electrically connected to predetermined lead terminals with metal filament (Au wire) 4 by wire bending or the like. A bypass capacitor 2 is electrically connected between the stage's face reverse to the chip 1 and Vss lead terminals and transfer-molded with a mold resin 5 including the chip 1 and a part of leads. The capacitor 2 can be incorporated in the semiconductor and installed at the shortest position of the chip 1; therefore, the power supply impedance as viewed from the chip 1 can be reduced.</p> |
