| 摘要 |
<p>PURPOSE:To reduce dust which adheres to a wafer and increase production yield of ICs and LSIs by inhaling a wafer gradually during a vacuum suction of the wafer to suppress dust from whirling up, introducing purge gas from line different from a vacuum pipe to make a wafer suction section return to air during the release of the wafer. CONSTITUTION:When a wafer 2 is sucked, a wafer suction section 8 is made to approach the wafer 2 and an automatic opening/closing valve A12 is opened. The flow rate of a master controller A13 is made zero. After the automatic opening/closing valve A12 is opened, ramping control is performed, and the pipe passage of a vacuum pipe 10 is opened. The vacuum of the suction section 8 is gradually increased so as to suck the wafer 2. When the wafer 2 is released, the automatic opening/closing valve A12 is closed, and an automatic opening/ closing valve B15 is opened. At this time, after the automatic opening/closing valve B15 is opened, ramping control is performed, and the pipe passage of a purge pipe 14 is opened. The vacuum of the suction section 8 is gradually decreased so as to release the wafer 2.</p> |
