| 摘要 |
PURPOSE:To increase in stability at the time of molding and wire bonding in order to prevent generation of a defect by connecting supporting projections in one or several spots to a frame by means of a fixing material. CONSTITUTION:A substance to be melted or buried into a finished article at the time of molding is used for a fixing material. Both ends of the fixing material 8 is fixed to a frame 1, and supporting projections 7 are fixed by this fixing material 8 followed by wire bonding pads 3 and lead terminals 4 with wires 5, and after wire bonding the whole is molded as it is. Thereby, generation of defectives to be caused by instability of semiconductor chips at the time of wire bonding and molding can be prevented. |
