| 摘要 |
PURPOSE:To improve the heat dissipating effect with an increased surface area of a tab by solidly forming a part between inner leads of a lead frame and a tab. CONSTITUTION:In a lead frame 10, a conductive plate-shaped material is punched and molded to form a lead 11a and a tab 13 soldly and a portion 12 between inner leads 11 and a tab 13 are put together. The tab 13 is bent at a level difference from the inner leads 11 to insulate the tab 13 and the inner lead 11. A semiconductor pellet 15 is fastened on the surface of the tab 13 while the tab 13 is buried with a highly conductive resin 18 and a packaging is made with upper and lower caps 19 and 17. |
