| 摘要 |
PURPOSE:To facilitate manufacture, and to obtain a small-sized chip carrier while reducing cost by forming the chip carriers in a many-sided manner by using one large-sized glass epoxy substrate. CONSTITUTION:Cu foils 8 are fitted on the surface and back of a glass epoxy substrate 7. A plurality of regions, which must function as chip carriers severally, are set to the substrate 7, and holes 9 for a plurality of through-holes are each bored previously in several region. These holes 9 are plated with Cu to form the through-holes 10. Patterns 11 for loading IC elements positioned at the central sections of the surface of each region, surface lead patterns 12, and surface lead patterns 12' for the GND of a power supply are formed by etching the Cu foils 8, thus manufacturing a chip carrier substrate. |
