| 摘要 |
PURPOSE:To contrive the improvement in assembling yield by providing a substrate supporting plate for fixing a semiconductor substrate, a third lead led from said substrate supporting plate, and a means for connecting a third electrode and the substrate supporting plate. CONSTITUTION:A right contact region 28 and a left barrier metal electrode 29 are electrically connected by, for example, vapor deposition of aluminum. Also on a right barrier metal electrode 29 and a left contact region 28, aluminum is evaporated as an electrode respectively. A chip 21 processed into one chip is pellet-bonded to a substrate supporting plate 3 of a lead frame and electrodes 30, 31 and leads 1, 2 are wire-bonded respectively. Furthermore, the electrodes 29 and the substrate supporting plate 3 are wire-bonded with a metallic thin wire 5, after which these are resin-molded. As a result, pellet bonding of one time becomes complete and characteristic defectives of only one side are reduced, thereby improving an assembling yield. |
