MANUFACTURE OF PRINTED WIRING BOARD

摘要

Printed circuit boards are produced by (1) forming, on the surface of a substrate a layer of a photosensitive resin composition comprising (1) 100 parts by weight of a photopolymerizable mixed component comprising 5 to 99% by weight of at least one kind of unsaturated compound (a) having at least one terminal methacryloyl group and no direct nitrogen-hydrogen bond and 95 to 1% by weight of at least one kind of unsaturated compound (b) having at least one terminal acryloyl group and no direct nitrogen-hydrogen bond and (ii) 0.5 to 20 parts by weight of a sensitizing agent or system capable of forming a free radical upon irradiation with an actinic ray and optionally up to 400 parts by weight of a linear high molecular compound having no direct nitrogen-hydrogen bond, (2) imagewise exposure through a negative mask, initially having non- transparent portions 21 and transparent portions 22 (Fig. 2) delineating the desired pattern, of the layer of the photosensitive resin composition to actinic irradiation and subsequent development by removal of those portions not exposed to radiation to form as an image a negative plating resist pattern and (3) electroless copper plating to form a circuit pattern on the surface portions of the substrate other than the negative pattern.