| 摘要 |
PURPOSE:To reduce the size of a package, by providing a through hole between a tab on which a semiconductor chip is to be secured and a tab lead for coupling the tab to an outer frame, by branching a part of the tab lead such that the branched parts have a smaller width than that of the tab. CONSTITUTION:A strain relieving through hole 9 is provided at a junction between a tab lead 8 and a tab 5 on which a semiconductor chip 6 is to be secured. Coupling sections 9a and 9b on the opposite sides of the through hole 9 are arranged symmetrically with respect to the central axis of the tab lead 8. A multiplicity of electrode connecting leads 4 are arranged around the tab 5. The provision of such strain relieving sections 9, 9a and 9b on the sides of the tab facilitates arrangement of an outer frame close to the tab as well as arrangement of the electrode connecting leads close to the tab lead. Accordingly, the size of the lead frame and hence of the package can be reduced easily.
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