| 摘要 |
PURPOSE:To laminate devices on a circuit board in a three-dimensional form and to improve mounting effect, by bonding the surfaces of the semiconductor devices, on which circuits are not formed. CONSTITUTION:A face-down type semiconductor device 1 is mounted on lands 4-1 on a circuit board 4 by a reflow soldering method. After the upper surface is washed, the surface of a bare-chip type semiconductor device 2, on which circuits are not formed, is stacked and bonded on said upper surface of the device 2 with a bonding agent 1-1. After electrode pads 2-1 of the bare-chip type semiconductor device 2 are washed, the pads 2-1 are wire-bonded to the lands 4-1 of the circuit board 4 through bonding wires 2-2. The surfaces of the semiconductor devices, which are substantially vacant regions, are assembled in a three-dimensional pattern and mounted as double layers. Thus the mounting efficiency on the circuit board can be improved.
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