| 摘要 |
<p>PURPOSE:To easily estimate whether a failure is attributed to a temperature at a failure analysis by a method wherein a means for recording a temperature history is provided inside an IC card incorporating a semiconductor element and other circuit elements. CONSTITUTION:A shape memory alloy spring 7 is extended at an ordinary temperature and contracted at a temperature higher than a shape recovery temperature. A temperature history can be recorded in accordance with the presence or absence of a shape change of the shape memory alloy spring 7. By incorporating a plurality of shape memory alloy springs 7 having different shape recovery temperatures in the same card, a temperature history can be recorded more accurately. Therefore, at the time of a failure analysis, whether the failure is attributed to a temperature can be easily estimated, and an analysis time can be reduced.</p> |
