Conveying lead frame for semiconductor chip - using clamp mechanism to hold lead frame while moving into position w.r.t. heating block

摘要

The method involves using a screw shaft (7) to move the lead frame (4) from the front side to the rear side of a heating block (1) along guide rails (3b) and movable rails (3a). The lead frame is held by a clamp (5c) with horizontal and vertical degrees of freedom. A sensor (8) detects the position of the lead frame during transport. A lead frame press (2) is arranged above the heating block (1) and has a vertical drive mechanism to press the lead frame against the block. ADVANTAGE - High accuracy transport and short conveying time.