| 摘要 |
PURPOSE:To enable efficient and reliable cutting of a cutting part in the middle of a circuit with a laser beam by a method wherein an organic resin film is applied on the scheduled conductor cutting part in the middle of the circuit, which is formed of a metal conductor on an insulating substrate. CONSTITUTION:An organic resin film 3 is formed on a conductor 2 formed on an insulating substrate 1, a laser beam 4 is emitted on the film 3 and the conductor 2 is cut simultaneously with the film 3. The film 3 is applied on a scheduled conductor cutting part 5. A polyimide film, a resist film or the like is used for the film 3, the thickness of the film is formed in a thickness of 1 to 5mum or thereabout and it is better to form width A slightly narrower than the width B of the conductor 2. When the width A is wider than the width B of the conductor 2, the resin carbonized after the emission of the laser beam is left and the insulation properties of a thin film circuit board are deteriorated. A photolithography method is suitable for the formation of this film 3 on the conductor 2. As the reflectivity of the film 3 to the laser beam is remarkedly small compared with the reflectivity of a metal to the laser beam and the energy of the laser beam can be efficiently absorbed, the conductor 2 can be reliably cut by one time irradiation of the laser beam. |
