| 摘要 |
PURPOSE:To suppress random reflection of the light transmitted into a package by coating at least one of a lead frame by which a solid-state image sensing element is fixed or a lead wire for wire-bonding the solid state image pickup element and lead frame with a polymer resin adding a dye having the effect for lowering reflectivity of light. CONSTITUTION:A solid-state image sensing element 1 is fixed on a lead frame 4 and it is then connected to the lead frame 4 with a lead 3 comprising a gold wire or aluminum wire for wire bonding. The solid-state image sensing element 1, lead frame 4 and lead wire 3 are packaged with a transparent resin 2 by the tranfer mold method. The wire lead 3 for wire bonding and the surface of lead frame 4 are coated with a polymer resin (for example, polyulethane, etc.) adding the dye of black color having the effect for lowering reflectivity of light by absorbing the light. |
