Amorphous hydrogenated carbon hermetic structure and fabrication method

摘要

A hard layer (20) of amorphous hydrogenated carbon (DLC) overlies a polymer film structure (12) and a plurality of soft layers (18) of DLC alternate with a plurality of hard layers (16) of DLC over the barrier base to form a corrosion resistant structure. The polymer film structure (12) and a circuit chip (19) can be elements of a circuit module. The DLC and the polymer film structure (12) can have vias extending to contact pads, and a patern of electrical conductors can extend through the vias to the contact pads. In one embodiment the DLC forms a hermetic (and therefore corrosion resistant) seal over the polymer film structure (12).