发明名称 |
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To improve the electronic components mounting efficiency of an electronic component mounting device providing with an intermittently rotated head section which is able to mount the electronic parts at a high speed for such electronic components that are to be clamped for transfer by providing a clamping unit to the device. SOLUTION: In an electronic component mounting device provided with a supplying means 9 which supplies electronic parts to a prescribed position, a mounting head 2 having a plurality of nozzles 3 which mount the electronic components on a printed board 7 positioned to a prescribed position, a head section 1 which has time mounting head 2 and intermittently rotates to move the electronic components their mounting positions from the prescribed position, and a pneumatic section 6 which gives pressures for holding and mounting the electronic components, a clamping unit 4 having a pair of pawls which clamp the electronic components with strong holding forces by means of springs and un-clamp the parts with a pneumatic pressure is provided to each mounting head 2. |
申请公布号 |
JPH11233995(A) |
申请公布日期 |
1999.08.27 |
申请号 |
JP19980028001 |
申请日期 |
1998.02.10 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
OTA HIROSHI;HIRAI WATARU;FUJIWARA MUNEYOSHI;MOTOKAWA YUICHI;MOGI SEIICHI |
分类号 |
B23P21/00;B25J15/00;H05K13/04 |
主分类号 |
B23P21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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