发明名称 APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To improve the electronic components mounting efficiency of an electronic component mounting device providing with an intermittently rotated head section which is able to mount the electronic parts at a high speed for such electronic components that are to be clamped for transfer by providing a clamping unit to the device. SOLUTION: In an electronic component mounting device provided with a supplying means 9 which supplies electronic parts to a prescribed position, a mounting head 2 having a plurality of nozzles 3 which mount the electronic components on a printed board 7 positioned to a prescribed position, a head section 1 which has time mounting head 2 and intermittently rotates to move the electronic components their mounting positions from the prescribed position, and a pneumatic section 6 which gives pressures for holding and mounting the electronic components, a clamping unit 4 having a pair of pawls which clamp the electronic components with strong holding forces by means of springs and un-clamp the parts with a pneumatic pressure is provided to each mounting head 2.
申请公布号 JPH11233995(A) 申请公布日期 1999.08.27
申请号 JP19980028001 申请日期 1998.02.10
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OTA HIROSHI;HIRAI WATARU;FUJIWARA MUNEYOSHI;MOTOKAWA YUICHI;MOGI SEIICHI
分类号 B23P21/00;B25J15/00;H05K13/04 主分类号 B23P21/00
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