发明名称 HYBRID MICROCIRCUIT GLASS-TO-METAL SEAL REPAIR PROCESS
摘要 A process (20) for repairing leaking glass-to-metal seals (13) of a hybrid micro-circuit header (10). The process (20) comprises the following steps. A leaking hybrid microcircuit header (10) is delidded (21) (has its lid (18) removed). The leaking hybrid microcircuit header (10), generally with its leads (12) pointing vertically, is disposed (22) on a vacuum source (15). A vacuum is formed (23) on the hybrid microcircuitheader (10) using the vacuum source (15). A stream of helium is flowed (24) over the seals (13) to verify the presence of leaks in the seals (13) of the hybrid microcircuit header (10). A small amount of high vacuum sealant (11) is applied (25) to each of the leaking glass-to-metal seals (13) while the hybrid microcircuit header (10) is exposed to the vacuum. The vacuum draws the sealant (11) through the cracked or defective glass-to-metal seals (13). The high vacuum sealant (11) generally comprises a silicone resin having a low vapor pressure. A stream of helium is caused to flow (26) over the resealed leads (12) following application of the high vacuum sealant (11) to confirm that the hybrid microcircuit header (10) is sealed. The hybrid microcircuit header (10) is removed (27) from the vacuum source (15). The hybrid microcircuit header (10) is then cured (28) at a temperature of 150 hours to complete the repair process (20). The lid (18) is reattached (seam sealed) following repairs. A final leak test is performed after reattachment of the lid (18).
申请公布号 CA2176270(C) 申请公布日期 1999.12.28
申请号 CA19962176270 申请日期 1996.05.10
申请人 发明人 MADJEREC, MICHAEL T.
分类号 H01L23/02;H01L21/50;(IPC1-7):H01L21/70;H01L21/77;H01L23/10;H05K3/00 主分类号 H01L23/02
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