| 摘要 |
PURPOSE: A dry etching equipment for manufacturing a semiconductor device is provided to prevent partial damage to a chamber and a polymer from being adhered, by complementing a concave slit portion with a liner. CONSTITUTION: In a dry etching equipment for manufacturing a semiconductor device, a detachable liner is established, which prevents a polymer from being directly adhered to a concave surface in a periphery of a slit portion among inner walls of a process chamber where a wafer comes in and out. The liner has the same shape as the wall of the slit portion of the chamber, closely established to the wall.
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