| 摘要 |
PURPOSE: A multi-layered circuit board is provided to enhance the usage rate of a top surface of the multi-layered circuit board and to prevent the generation of cracks when scribing the circuit board. CONSTITUTION: A through hole is formed in two layers(51,52) of a multi-layered circuit board consisting of 3 layers and any through hole is not formed in the other layer(1). Therefore, the usage rate of a top surface of the multi-layered circuit board is increased since the through hole isn't formed in the top layer(1). In addition, cracks are not created when scribing the multi-layered circuit board, since the stress concentration due to the through hole isn't generated. Further, patterns of the layers(51,52) are connected to each other through the through hole, whereby the layers(51,52) are electrically connected to each other through the through hole.
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